Group Lead
Stoyan Stoyanov
Reader in Computational Engineering and Optimisation
Contact details
The Computational Mechanics and Reliability Group (CMRG) has research interests in the development and application of computer models for multi-physics/multi-scale predictions, numerical optimisation, physics-of-failure analysis, reliability and quality assessments, and maintenance of engineering structures. The group is also active in research on industrial data analytics and computational intelligence technologies. A particular focus of its modelling research is applied to microelectronics manufacturing and test, and to electronic components and microsystems. Under the direction of Dr Stoyan Stoyanov, the group is one of the main contributors to the Centre for Advanced Simulation and Modelling (CASM).
Publications
As a research team we publish in high ranking journals and present our work at international conferences. Since 2004 the group has authors over 300 papers. Further details on our publication can be found on GALA.
Recent publications
Article
Stoyanov, Stoyan , Bailey, Chris, Microchip Technology Inc., Amethyst Research (2023), . IEEE. In: , , , . IEEE, IEEE Access . pp. 35207-35219 2169-3536 (Online) (doi: https://doi.org/10.1109/ACCESS.2023.3264806).
Santhanakrishnan, Mani Sekaran , Tilford, Timothy, Bailey, Christopher (2022), . Emerald. In: , , , . Emerald, International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3) . pp. 1203-1228 ISSN: 0961-5539 (Print), (doi: https://doi.org/10.1108/HFF-06-2022-0386).
Xu, Yilun , Xian, Jingwei, Stoyanov, Stoyan, Bailey, Christopher , Coyle, Richard , Gourlay, Christopher , Dunne, Fionn , Nokia Bell Labs, Murray Hill, New Jersey, USA (2022), . Elsevier. In: , , , . Elsevier, International Journal of Plasticity, 155: 103308 ISSN: 0749-6419 (Print), (doi: https://doi.org/10.1016/j.ijplas.2022.103308).
Santhanakrishnan, Mani Sekara , Tilford, Tim, Bailey, Chris (2021), . Emerald. In: , , , . Emerald, International Journal of Numerical Methods for Heat and Fluid Flow, 32 (3) . pp. 1025-1045 ISSN: 0961-5539 (Print), (doi: https://doi.org/10.1108/HFF-10-2020-0656).
Tilford, Tim , Stoyanov, Stoyan, Braun, Jessica, Janhsen, Jan Christoph , Patel, Mayur K. , Bailey, Chris (2021), . IEEE. In: , , , . IEEE, IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2) . pp. 351-362 ISSN: 2156-3950 (Print), 2156-3985 (Online) (doi: https://doi.org/10.1109/TCPMT.2021.3049952).
Hinojosa Herrera, Ana , Walshaw, Chris, Bailey, Chris (2020), . International Association of Educators and Researchers (IAER). In: , , , . International Association of Educators and Researchers (IAER), Annals of Emerging Technologies in Computing (AETiC), 4 (3) . pp. 9-16 ISSN: 2516-0281 (Print), (doi: https://doi.org/10.33166/AETiC.2020.03.002).
Rajaguru, Pushpa , Lu, Hua, Bailey, Chris, Bella, Martina (2020), . Elsevier. In: , , , . Elsevier, Microelectronics Reliability, 110: 113697 ISSN: 0026-2714 (Print), (doi: https://doi.org/10.1016/j.microrel.2020.113697).
Stoyanov, Stoyan , Bailey, Christopher, Stewart, Paul, Parker, Mike , Roulston, John F. , Leonardo MW Ltd , Micross Components (2020), . IEEE. In: , , , . IEEE, IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3) . pp. 502-515 ISSN: 2156-3950 (Print), 2156-3985 (Online) (doi: https://doi.org/10.1109/TCPMT.2020.2972635).
Shahjalal, Mohammad , Rishad Ahmed, MD, Lu, Hua, Bailey, Chris , Forsyth, Andrew (2020), . IEEE. In: , , , . IEEE, IEEE Transactions on Power Electronics, 35 (9) . pp. 9082-9094 ISSN: 0885-8993 (Print), 1941-0107 (Online) (doi: https://doi.org/10.1109/TPEL.2020.2969350).
Ahsan, M. , Stoyanov, S., Bailey, C., Albarbar, A. (2020), . IEEE. In: , , , . IEEE, IEEE Access, 8 . pp. 16922-16933 2169-3536 (Online) (doi: https://doi.org/10.1109/ACCESS.2020.2967858).
Hinojosa Herrera, Ana Elsa , Stoyanov, Stoyan, Bailey, Christopher, Walshaw, Christopher , Yin, Chunyan (2019), . De Gruyter Open. In: , , , . De Gruyter Open, Open Computer Sciences, 9 (1) . pp. 200-211 2299-1093 (Online) (doi: https://doi.org/10.1515/comp-2019-0014).
Bailey, Christopher , Yin, Chunyan, Rajaguru, Pushparajah (2019), . IEEE. In: , , , . IEEE, IEEE ACCESS, 7 . pp. 54658-54669 2169-3536 (Online) (doi: https://doi.org/10.1109/ACCESS.2019.2911260).
Tonry, Catherine E. H. , Patel, Mayur K., Yu, Weixing, Desmulliez, Marc P. Y. , Bailey, Christopher (2019), . Springer Berlin Heidelberg. In: , , , . Springer Berlin Heidelberg, Microsystem Technologies . pp. 1-8 ISSN: 0946-7076 (Print), 1432-1858 (Online) (doi: https://doi.org/10.1007/s00542-019-04409-z).
Stoyanov, Stoyan , Ahsan, Mominul, Bailey, Chris, Wotherspoon, Tracy , Hunt, Craig , Microchip Technology Inc. (2019), . Springer US. In: , , , . Springer US, Journal of Intelligent Manufacturing, 30 (3) . pp. 1497-1514 ISSN: 0956-5515 (Print), 1572-8145 (Online) (doi: https://doi.org/10.1007/s10845-018-01462-9).
Book section
Flynn, David , Bailey, Christopher, Rajaguru, Pushpa, Wenshuo, Tang , Yin, Chunyan (2019), . Wiley-Blackwell. In: , , In: Douglas Goodman, James P. Hofmeister, Ferenc Szidarovszky (eds.), Prognostics and Health Management: A Practical Approach to Improving System Reliability Using Condition-Based Dat. Wiley-Blackwell, . ISBN: 9781119356653 (doi: ) NB Item availability restricted.
Conference item
Malik, Asif , Rajaguru, Pushparajah, Azzawi, Rula (2022), . In: 8th International Conference on Information Technology Trends, 25th - 26th May 2022, Dubai, UAE , . , (doi: https://easychair.org/cfp/ITT2022).
Conference proceedings
Stoyanov, Stoyan and , Bailey, Chris (2022), . Institute of Electrical and Electronics Engineers (IEEE). In: , , , 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE. Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey (1st) . pp. 1-7 . ISBN: 9781665458375 (doi: https://doi.org/10.1109/EuroSimE54907.2022.9758885).
Stoyanov, Stoyan , Stewart†, Paul, Bailey, Christopher (2021), . Institute of Electrical and Electronics Engineers (IEEE). In: , , In: Paul Stewart (ed.), 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey (1st) . pp. 1-8 . ISBN: 9780956808677 ; 9781665423687 (doi: https://doi.org/10.23919/EMPC53418.2021.9584970).
Hinojosa Herrera, Ana Elsa , Walshaw, Chris, Bailey, Chris (2020), . IEEE. In: , , , 2020 15th IEEE Conference on Industrial Electronics and Applications (ICIEA. IEEE, . pp. 1092-1097 . ISBN: 9781728151694ISSN: 2156-2318 (Print), 2158-2297 (Online) (doi: https://doi.org/10.1109/ICIEA48937.2020.9248258) NB Item availability restricted.
Stoyanov, Stoyan , Bailey, Christopher, Waite, Rhys, Hicks, Christopher , Golding, Terry , Microchip Technology Inc (Microsemi) , Amethyst Research Inc (2020), . IEEE. In: , , , 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC. IEEE, . pp. 1-8 . ISBN: 9780956808660 (doi: https://doi.org/10.23919/EMPC44848.2019.8951842).
Hinojosa Herrera, Ana Elsa , Walshaw, Chris, Bailey, Chris, Yin, Chunyan (2019), . IEEE. In: , , In: Mahdi H. Miraz, Peter S. Excell, Andrew Ware, Safeeullah Soomro, Maaruf Ali (eds.), Proceedings of the IEEE International Conference on Computing, Electronics & Communications Engineering 2019 (IEEE iCCECE '19. IEEE, . pp. 100-105 . ISBN: 9781728121383 (doi: https://doi.org/10.1109/iCCECE46942.2019.8941849).
Rajaguru, Pushparajah , Santhanakrishnan, Manisekaran, Tilford, Tim, Bailey, Chris (2019), . IEEE. In: , , , 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC. IEEE, . ISBN: 9781728120782ISSN: 2474-1515 (Print), 2474-1523 (Online) (doi: https://doi.org/10.1109/THERMINIC.2019.8923530).
Hinojosa Herrera, Ana Elsa and , Stoyanov, Stoyan (2019), . IEEE Xplore. In: , , , Proceedings of the 2018 International Conference on Computing, Electronics & Communications Engineering (iCCECE. IEEE Xplore, . pp. 59-64 . ISBN: 9781538649046 (doi: https://doi.org/10.1109/iCCECOME.2018.8658941).